The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 1987

Filed:

Jul. 27, 1984
Applicant:
Inventors:

Donald C Eckert, Lancaster, PA (US);

J Richard George, Rapho Township, Lancaster County, PA (US);

George L Lilley, Rapho Township, Lancaster County, PA (US);

Darryl L Sensenig, Manor Township, Lancaster County, PA (US);

James A Tshudy, Ephrata Township, Lancaster County, PA (US);

Assignee:

Armstrong World Industries, Inc., Lancaster, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428 47 ; 428219 ; 428246 ;
Abstract

The present invention concerns loose-lay floor structures comprising at least two layers of reinforcing material and processes to design and produce them. Loose-lay floors may be designed which will be suitable for use over stable subfloors, or which will accommodate the movement of very unstable subfloors. Flooring constructed according to this invention will have the ability to resist buckling, curling and doming, and will resist moving under a rolling load. A process is also provided for modifying structures comprising a single reinforcing layer in situ so as to convert structures with unacceptable buckling characteristics into structures with acceptable buckling characteristics. As an alternative, the reinforcing layer may be premodified such that, when used to provide a surface covering, the covering will have acceptable buckling characteristics. In appropriate circumstances, surface coverings of the present invention may also be adhered to subsurfaces, and processes are described wherein the required adhesive capacity of an adhesive can be calculated.


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