The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1987
Filed:
Aug. 15, 1984
Toshinari Ando, Ibaraki, JP;
Yoshikazu Takahashi, Ibaraki, JP;
Masataka Nishi, Mito, JP;
Susumu Shimamoto, Ibaraki, JP;
Katsuzo Aihara, Hitachi, JP;
Naofumi Tada, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Japan Atomic Energy Research Institute, Tokyo, JP;
Abstract
An aluminum-stabilized superconducting wire comprises an aluminum member, a copper member, and a first diffusion barrier layer formed between the aluminum member and the copper member. The copper member contains a plurality of bundles each having a multiplicity of fine filaments of Nb.sub.3 Sn embedded in a copper alloy and a second diffusion barrier layer surrounding the copper alloy. Preferably, the ratio m in the cross-sectional areas between the first diffusion barrier layer and the aluminum member is selected to meet the condition of 0.03.ltoreq.m<3. The aluminum member is disposed at the central portion of the superconducting wire.