The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 1987

Filed:

Oct. 23, 1984
Applicant:
Inventors:

John E Schumacher, III, Boulder, CO (US);

Gene A Fisher, Lafayette, CO (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K / ;
U.S. Cl.
CPC ...
29848 ; 29847 ; 174 685 ; 427 97 ;
Abstract

An improved method is disclosed for forming a printed circuit board. The desired printed circuit is established on the surface of a plastic core sheet by placing recesses therein conforming to the desired circuit, and a conductive coating is then applied so that the coating is retained at the recesses. Circuit patterns are preferably pressed into one or both sides of the plastic core sheet, and holes can be placed through the sheet to allow circuit connections between the patterns on the opposite sides of the sheet and to receive electrical leads of circuit components. A thin conductive coating is applied by vacuum deposition, and can be thickness enhanced by electroplating. In addition, multilayered printed circuit boards of more than two layers can be formed by applying one or more laminate sheets of plastic to the surfaces of a core sheet having printed circuits formed thereon, and then pressing circuit patterns into the exposed side of the laminate sheets to form recesses therein, which surfaces then have conductive material applied thereto so that the conductive material is retained at the recesses therein to thus form additional printed circuit board layers.


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