The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1987
Filed:
Sep. 22, 1983
Allan C Burgess, Yorktown Heights, NY (US);
Robert O Lussow, Hopewell Junction, NY (US);
George E Melvin, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multilayer ceramic integrated circuit packaging substrate provides a plurality of integrated circuit operating voltages at the integrated circuit mounting surface thereof without requiring a separate input/output pin and internal power distribution plane for every integrated circuit operating voltage. The substrate includes a power via for supplying a first integrated circuit operating voltage at the integrated circuit mounting surface, and a plurality of voltage converting means on the integrated circuit mounting surface for stepping down the first operating voltage to all other requisite operating voltages. The voltage converting means may be resistors or operational amplifier voltage dividers.