The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 1987
Filed:
Feb. 06, 1985
Dat V Ngo, Allentown, PA (US);
Elliot G Jacoby, Glenside, PA (US);
Lutron Electronics Co., Inc., Coopersburg, PA (US);
Abstract
A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative sheet is disposed between a flat electrically conductive surface of the semiconductor device and the flat electrically conductive surface of the heat sink which is to receive the semiconductor device. The semiconductor device is fixed to the insulation sheet by a first electrically conductive rivet which compresses the two together. The opening in the insulation sheet through which the rivet passes is enlarged so that no radial forces are applied to the sheet by expansion of the rivet. The rivet head on the bottom of the insulation sheet extends into an enlarged opening in the underlying heat sink but does not touch the opening. The insulation sheet is connected to the heat sink by a second conductive rivet which is laterally displaced from the first, and applies compressive forces between the insulation sheet and heat sink. The opening in the insulation sheet receiving the second rivet is also enlarged so that radial forces cannot be applied from the rivet to the insulation sheet. The insulation sheet is sufficiently rigid so as to hold the full surface of the semiconductor device against the full adjacent surface of the sheet, and to hold the opposite surface of the sheet against the heat sink. The invention is used for mounting of various semiconductor device package styles including the TO-220 outline and the stud mounted outline package.