The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 1987
Filed:
Jul. 07, 1983
Jean M Lalancette, Sherbrooke, CA;
Societe Nationale de l'Amiante, Thetford-Mines, CA;
Abstract
There is provided a method for preparing cured moulded article of a predetermined density of from 1.66 to 9.0 which comprises selecting the resin and determining it % weight loss and % porosity under the curing conditions for the selected resin, then selecting a high density filler and a low density filler and resolving the equation: ##EQU1## wherein K is the desired density of the end product and has a value of from 1.66 to 9.0; HD is the density of the selected high density substantially water-insoluble material and has a value of above 3.2; ID is the density of the selected medium density substantially water-insoluble material and has a value of from 1.5 to 3.2; R is the density of the cured binding resin and has a value between 0.8 to 1.5; A is the percentage by weight of the selected high density filler having the density HD and has a value of from 10 to 90%; B is the percentage by weight of the selected medium density filler having the density ID and has a value of from 0 to 86%; C is the percentage by weight of the selected binding resin having the density R and has a value of from 4 to 70%; and Y is the porosity of the end product expressed in % of the volume of the moulded object.