The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 1987
Filed:
Sep. 05, 1984
Applicant:
Inventors:
Gerard E Henein, Berkeley Heights, NJ (US);
Ralph T Hepplewhite, Millington, NJ (US);
Bertram Schwartz, Westfield, NJ (US);
Assignee:
AT&T Bell Laboratories, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228123 ; 228220 ; 228200 ; 22826312 ; 219 / ; 219 / ;
Abstract
Indium is used to bond semiconductor lasers to their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding is achieved in a vacuum chamber in reducing ambients of CO or H.sub.2. Low strain bonds are achieved at bonding temperatures of approximately 180.degree.-240.degree. C. in CO and 220.degree.-230.degree. C. in H.sub.2. Void-free bonds are achieved in CO at temperatures as low as about 205.degree. C. The technique is applicable to other microelectronic chips such as LEDs, for example.