The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1987
Filed:
Jul. 31, 1985
Applicant:
Inventors:
Hironobu Watanabe, Furukawa, JP;
Akira Sakai, Miyagi, JP;
Assignee:
Alpine Electronics Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H / ;
U.S. Cl.
CPC ...
200 / ; 200 / ; 200 / ;
Abstract
A dual in-line package (DIP) switch includes movable terminals and fixed terminals all of which are inserted in a wafer by insert molding. The two rows of terminals have terminal portions including contact portions. The terminal portions of the two rows are disposed substantially parallel to each other and spaced apart a given distance within a casing in such a way that the corresponding contact portions can either make or break contact with each other.
Quick Actions:
Watanabe, Hironobu. (1987). Dip switch having single terminal-contact support wafer (U.S. Patent No. 4644110). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4644110
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile