The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 1987

Filed:

Nov. 13, 1985
Applicant:
Inventors:

Patrick J Bowles, Louisville, KY (US);

Lloyd W Garrett, Louisville, KY (US);

John V Howard, Louisville, KY (US);

Robert F Heil, Sr, Louisville, KY (US);

Assignee:

General Electric Company, Louisville, KY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425406 ; 425420 ; 4254519 ;
Abstract

An apparatus for molding a plurality of articles of hardenable material such as plastic which requires each article to be maintained under heat and pressure for a cure interval. A molding press is utilized wherein there is placed a first open mold assembly having spaced die halves between supporting mold platens. At least one of the die halves has a resilient pressure pad between the die and the mold platen supporting the die half. The press is closed to maintain the mold platens in a first force applying position having a slight gap between the die halves and locking the platens in the first position. The mold assembly is removed while in its first locked position from the press and gas from the curing material is evacuated through the gap between the die halves while heating the material. The mold assembly in its first locked position is again placed in the press and the press is closed to unlock the mold assembly and apply and maintain a second molding force greater then the first molding force and sufficient to completely close the die halves to a second position for curing the material and compress the resilient pressure pad. The mold platens are locked in the second position whereby the pressure pad will apply internal forces against the dies to maintain the correct curing pressure in the event of shrinkage of the cured material. The mold assembly is removed from the press in its second locked position and the material is cured under pressure and at elevated temperatures for the correct time interval to form the article. Finally, the mold assembly is unlocked and the article is removed therefrom.


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