The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1987
Filed:
Sep. 20, 1985
Shozo Umeda, Tokyo, JP;
Norio Tsukiji, Sakai, JP;
Takuya Aiko, Sakai, JP;
Toshiharu Kittaka, Sakai, JP;
Heizaburo Furukawa, Hiroshima, JP;
Kanji Wake, Hiroshima, JP;
Yoshio Shimozato, Hiroshima, JP;
Kenichi Yanagi, Hiroshima, JP;
Mitsuo Kato, Hiroshima, JP;
Tetsuyoshi Wada, Hiroshima, JP;
Nisshin Steel Company, Ltd., Tokyo, JP;
Mitsubishi Jukogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
Disclosed is a combined continuous plating apparatus for hot-dip plating and vacuum deposition plating characterized in that the outlet of the gas reduction annealing furnace of a conventional continuous hot-dip plating apparatus and the inlet of the seal roll chamber of a known continuous vacuum deposition plating apparatus are connected through a pressurized chamber in order to prevent invasion of hydrogen-containing reduction gas into the vacuum deposition chamber, whereby is prevented the possibility of the hydrogen-containing gas causing an explosion should air leak into the vacuum deposition chamber.