The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 1987
Filed:
Apr. 29, 1985
Applicant:
Inventor:
Candice H Brown, San Jose, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29832 ; 29840 ; 174 / ; 357 81 ;
Abstract
The invention discloses an improved PC board package for one or more integrated circuit dies comprising a plurality of PC boards bonded together to form a composite. The composite has at least one cavity, for mounting of an integrated circuit die, formed in at least one PC board of the composite. The cavity walls are plated to seal off portions of the PC board exposed by formation of the cavity to thereby prevent subsequent outgassing. Heat pipes are formed in a PC board adjacent the PC board with the cavity to conduct heat from an integrated circuit chip mounted in the cavity to an opposite surface of the package.