The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 1987
Filed:
Jan. 17, 1985
Applicant:
Inventors:
Assignee:
Matsushita Electronics Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
29588 ; 29591 ; 2957 / ; 357 70 ;
Abstract
A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. An external lead of a lead frame extends to one side of a substrate support serving as a heat sink and supporting a semiconductor substrate, and strips of the lead frame extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds for plastic encapsulation so that a thin film of plastic is uniformly formed on a lower surface of the substrate support. A connecting portion between the external lead and a connecting band and the strips extending from a plastic encapsulating housing to the outside are cut.