The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 1986
Filed:
Sep. 27, 1983
Applicant:
Inventor:
Thomas A Zimmerman, Rancho Palos Verdes, CA (US);
Assignee:
TRW Inc., Redondo Beach, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 75 ; 357 80 ;
Abstract
An integrated circuit package has a conductive ring surrounding the integrated circuit substrate and optionally, over the integrated circuit itself, and wires connected between selected chip pads and adjacent portions of the surrounding ring, the surrounding ring being connected to only one of a plurality of external conductive pins of the chip package, the remainder of the external pins being connected to other selected chip pads.
Zimmerman, Thomas. (1986). Multiple path signal distribution to large scale integration chips (U.S. Patent No. 4631572). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4631572
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile