The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 1986
Filed:
Jan. 22, 1986
Helmut Markert, Nuremberg, DE;
Klaus-Robert Hauschildt, Nuremberg, DE;
Wolfgang Rogler, Erlangen, DE;
Klaus Kretzschmar, Erlangen, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
This invention relates to a method for the manufacture of molded material for an insulating component made of a quick-hardening reaction resin which employs a hardening catalyst. An object of the invention is to provide reaction resins which allow the manufacture of molded materials with increased dimensional heat resistance and at the same time, good mechanical properties. According to the invention, a reaction resin mixture of a polyepoxide and a polyisocyanate (EP/IC resin) with a formula mole ratio EP:IC of about 1 to 5 and a viscosity of up to about 7000 mPa.multidot.sec (at 25.degree. C.) is cross-linked under pressure by means of a tertiary amine or imidazole hardening catalyst at a gelling temperature of about 130.degree. to 150.degree. C. and is post-hardened at a temperature of 150.degree. to 200.degree. C. This produces a reaction resin molded material (OX/ICR molding material) containing oxazolidinone and isocyanurate rings with a mole ratio OX:ICR greater than 1 and, after hardening, the reaction of the epoxy and isocyanate groups of the EP/IC resin, is above about 90%.