The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 1986

Filed:

Nov. 29, 1984
Applicant:
Inventors:

Hirofumi Maeda, Takatsuki, JP;

Kazuyoshi Watanabe, Settsu, JP;

Naruhiko Akamatsu, Settsu, JP;

Kenichi Senda, Hirakata, JP;

Shunichi Nishioka, Kobe, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J / ; C08J / ;
U.S. Cl.
CPC ...
264 53 ; 264D / ; 264D / ; 264D / ; 264101 ;
Abstract

A method for aging an expansion-molded body of polyolefin prepared by heating pre-expanded polyolefin particles within a mold involves cooling the molded body within the mold so that the molded body is not substantially smaller than the volume of the mold cavity and is temporarily expandable after being removed from the mold to not more than 110% relative to the volume in the mold cavity, removing the molded body from the mold, placing the molded body in an atmosphere substantially under atmospheric pressure and having a temperature of 25.degree. to 55.degree. C. lower than the melting point of the polyolefin while the volume of the molded body is 70 to 110% relative to the volume of the mold cavity and holding the molded body in this atmosphere until the temperature of the molded body is at least equal to the temperature of the atmosphere.


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