The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 1986
Filed:
Jul. 08, 1985
Northern Telecom Limited, Montreal, CA;
Abstract
A method of forming a molded encapsulation around a sealed spliced region between two cables in which the cables pass through a mold with the splice region in the mold cavity and correctly centered before molding. To allow for the centering operation to be performed, apertures are provided in the mold. Hook members are passed through the apertures. These hook members are caused to engage both inner and outer mold surfaces and they also engage tie means at two circumferentially spaced positions around the splice region to centralize the region within the cavity. The mold is then filled with molten material and the hooks removed from the apertures with the material still molten. Hook removal may take place either when the cavity is completely filled or after sufficient molten material has entered the mold to hold the splice region in fixed position. The method is applicable to low pressure molding, i.e. below 100 psi and preferably below 50 psi.