Electronic circuit element insertion apparatus

Abstract

A lead clamping apparatus clamps and mounts to an electronic circuit board an electronic element having a plurality of leads which are arranged in two rows and are oriented in the same direction. The apparatus includes a plurality of pairs of clamping members arranged in the same direction as the two rows of leads, a support slidable in a direction perpendicular to the direction of pivotal movement of the clamping members to abut against a desired number of the clamping members, whereby allowing the same to perform a clamping action, a drive source for slidingly driving the support, a piston for opening and closing the clamping members through the support, and a pusher slidable in the same direction as the support and for biasing the electronic element to insert the same into the circuit board. Accordingly, it is possible to selectively use the clamping members, of which number corresponds with that of the leads of the electronic element. If there is a sufficient area in an electronic circuit board to receive an electronic element being mounted, the element can be mounted on the board irrespective of other electronic elements having been previously mounted on the board. Programming of production process, and design of electronic circuit boards can be greatly facilitated by the invention.