The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 1986

Filed:

Apr. 17, 1984
Applicant:
Inventors:

Melvin C August, Chippewa Falls, WI (US);

John T Williams, Chippewa Falls, WI (US);

Assignee:

Cray Research, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361388 ; 361386 ; 361414 ;
Abstract

A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.


Find Patent Forward Citations

Loading…