The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 1986
Filed:
Dec. 17, 1984
Wen-Hsuan Chang, Gibsonia, PA (US);
David T McKeough, Gibsonia, PA (US);
PPG Industries, Inc., Pittsburgh, PA (US);
Abstract
Disclosed is an ungelled resin comprising a compound corresponding to a specified formula (I) which compound typically is prepared by reaction of an aminoalkyloxy silane with an organic isocyanate. The ungelled resin contains a hydrolyzable group that is attached directly to Silicon. The ungelled resin can be utilized in coating compositions. The ungelled resin can be cured with moisture and/or with polyols, and can be used to provide protective and/or decorative films on a variety of substrates. The novel compounds contained in the ungelled resin for convenience can be thought of as prepared from an organic isocyanate having an average functionality of at least 1; a silicon-containing compound corresponding to a specified formula (III) infra, the silicon-containing compound having at least one hydrolyzable group; and a compound containing at least 2 carbon atoms, at least 1 functional group reactive with a moiety on the silicon-containing compound and at least one amino group. A compound of the resin contains at least one hydrolyzable group from the silicon-containing compound. A compound of the resin also contains a residue of the silicon-containing compound bonded to a residue of the compound containing at least 2 carbon atoms through an oxygen-silicon linkage.