Mirror wafer of compound semiconductor

Abstract

Compound semiconductors belonging to groups III-V have a crystalline structure of the zinc blend type. Wafers sliced from a single crystal ingot on {100} planes have four cleavage planes. Two parallel cleavage planes are equivalent. But two cleavage planes perpendicular with each other are unequivalent. The etching speeds on the unequivalent cleavage planes are different for some pertinent etchant. A difference of the mesa direction and the reverse-mesa direction along unequivalent cleavage planes exists in compound semiconductors unlike silicon semiconductor. By an etching process using a pertinent etchant natural anisotropic patterns appear on the rear side of a wafer to denote the mesa direction on the front surface. Natural patterns have generally elongate shapes parallel to each other, resembling lines or ellipsoids. The direction of the longer side is the mesa direction on the front surface. Otherwise artificial parallel patterns can be formed on the rear surface to denote the mesa direction by photoetching process using photoresist and a mask with anisotropic pattern. This invention is especially useful for rectangular or square wafers which do not have orientation flats on the peripheries.