The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 1986

Filed:

Jul. 29, 1985
Applicant:
Inventor:

Keith G Spanjer, Scottsdale, AZ (US);

Assignee:

Motorola Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
427-5 ; 430308 ; 430330 ; 427 82 ;
Abstract

Passivation, alpha protection and other relatively thick, patterned layers are applied to semiconductor wafers by a screen printing method. Patterned emulsions carried on fine mesh stainless steel screens are tempered at elevated temperatures to harden the emulsion. The screens so prepared withstand many cycles of printing and cleaning with harsh solvents present in screenable polymers such as polyimide and rigid silicone.


Find Patent Forward Citations

Spanjer, Keith. (1986). Method for applying material to a semiconductor wafer (U.S. Patent No. 4627988). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4627988

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…