The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 1986

Filed:

Sep. 26, 1985
Applicant:
Inventors:

Kurt Meier, Allschwil, CH;

Niklaus Buhler, Rheinfelden, CH;

Jean-Francois Reber, Riehen, CH;

Assignee:

Ciba-Geigy Corporation, Ardsley, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 531 ; 20415715 ; 427 541 ; 427217 ;
Abstract

Copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium can be deposited by photoredox reaction on semiconductor sulfide powders by irradiating a suspension of semiconductor sulfide powder in the presence of oxygen and optionally CO.sub.2, of an oxidizable system which optionally protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium.


Find Patent Forward Citations

Meier, Kurt. (1986). Process for the deposition of metals on semiconductor powders (U.S. Patent No. 4619838). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4619838

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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