The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 1986
Filed:
Dec. 24, 1984
Takashi Tanaka, Yamagata, JP;
Kenro Hayashi, Hadano, JP;
Toshiba Ceramics Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing extremely high purity parts for use to the heating furnace comprising adding a sintering assistant of 0.5-2.0 weight % and a binder, to SiC powder which has an average particle diameter of 2 .mu.m or less, and molding it to a predetermined form; applying the purification treatment to this molded body by placing it in the 800.degree.-1,300.degree. C. atmosphere of a gas which is selected from a group consisting of halogen gas and hydrogen halide; degassing the purified molded body in vacuum under a temperature higher than that employed at the purification treatment; sintering the degassed molded body, and coating an SiC film on at least part of the sintered body according to the chemical vapor deposition.