The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 1986

Filed:

Jan. 18, 1985
Applicant:
Inventors:

Hans-Jorg Christen, Untersiggenthal, CH;

Hubert Devantay, Neuenhof, CH;

Claude Schellenberg, Birmenstorf, CH;

Gunther Scherer, Gebenstrof, CH;

Samuel Stucki, Nussbaumen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D / ; H01M / ;
U.S. Cl.
CPC ...
2042 / ; 429 44 ;
Abstract

A bipolar plate for an apparatus having a stacked configuration, said apparatus comprised of a plurality of electrochemical cells and employing a solid electrolyte, said bipolar plate comprised of a porous titanium plate (1) having a parallel groove structure (3), said bipolar plate further comprised of a non-porous, solid titanium plate (2) strongly welded to plate (1) at contact loci (4), wherewith channels (5) are present, and said bipolar plate further comprised of a surface layer or coating (6) comprised of a material which is a catalyst for electrolytic reactions. A method of manufacturing the subject bipolar plate, comprising the following: Powder metallurgical manufacture of the porous titanium plate (1), and bonding of plate (1) to the solid titanium plate (2) by sintering. Further development of the bipolar plate by applying a non-porous, solid graphite and PVF composite plate (7) with a parallel groove structure (8), and further applying a porous graphite and PVF composite plate (10), wherewith channels (9) are present. Combining of the plates by hot pressing, sintering, or adhesive bonding, to form a compact, mechanically strong electrically conducting whole.


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