The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 1986
Filed:
Jun. 03, 1985
Kiyohito Okamura, Ibaraki, JP;
Yoshio Hasegawa, Ibaraki, JP;
Yoshiyasu Kuroo, Koganei, JP;
Masana Ugaji, Tokyo, JP;
Sony Corporation, Tokyo, JP;
The Foundation: The Research Institute for Special Inorganic Materials, Tokyo, JP;
Abstract
A molded product consisting mainly of silicon carbide and a process for mfacturing the same. This invention is to provide a product having a desired or complicated shape and a process which enables the manufacture of any such product at a drastically lower temperature than any conventional process. This object is attained by applying an organic silicon polymer having a skeleton composed mainly of carbon-silicon bonds by impregnation or adherence to a base material having a desired shape, and by burning the base material at a temperature of 700.degree. C. to 2,000.degree. C. in a vacuum or in a nonoxidizing gas atmosphere. The product of this invention has a fibrous, granular and/or filmy carbon structure in the matrix consisting mainly of SiC. The product of this invention is useful for a wide variety of applications, for example, for making heat-resistant structural members of electronic devices.