The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 1986
Filed:
Sep. 27, 1984
Applicant:
Inventor:
Candice H Brown, San Jose, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
29588 ; 29589 ; 29590 ; 29591 ; 357 68 ; 357 72 ; 357 74 ; 174 / ;
Abstract
An improved package for a semiconductor device comprises an integrated circuit die and a mounting package having an array of parallel leads which directly connect perpendicular to the die. The process for making the package comprises forming an array of parallel, spaced apart, conductor pins; bonding the array of parallel conductor pins directly to an integrated circuit die while maintaining the die in a plane perpendicular to the parallel pins; and surrounding the die with a package material capable of protecting the die.