The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 1986
Filed:
Feb. 14, 1985
Applicant:
Inventor:
Tamaki Iida, Tokyo, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428335 ; 427 96 ; 428336 ; 428469 ; 428698 ; 428701 ; 428901 ;
Abstract
A copper-foiled laminate suitable as a base plate of printed circuit boards and the like electronic parts. The laminate is composed of an aluminum plate as the base, a layer of aluminum oxide formed on the aluminum plate, a layer of an amorphous silicon carbide formed on the aluminum oxide layer and a copper foil adhesively bonded to the surface of the silicon carbide layer so that the laminate has a high thermal conductivity providing a heat dissipative surface essential in high-performance electronic parts.