The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 1986

Filed:

Aug. 23, 1985
Applicant:
Inventors:

Hiroaki Nishio, Yokohama, JP;

Yasushi Ueno, Yokohama, JP;

Jun Harada, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
419 68 ; 249 65 ; 249112 ; 249183 ; 264571 ; 264D / ; 4254 / ; 425D / ;
Abstract

A method of compression molding powders of metals, ceramics and the like. A thin rubber bag is adhered to the inside of a cavity formed within a permeable mold support so as to define a mold therein and the bag is packed with a raw material powder. The powder in the bag is evacuated to a degree of vacuum to compactly compress it and the rubber bag is sealed. In this condition, the compressed powder is removed from the support and compression molded to a higher degree of denseness by the CIP process. The inflation adhesion of the rubber bag to the inside of the support cavity is effected by reducing the pressure outside the permeable support.


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