The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 1986
Filed:
Sep. 18, 1984
Applicant:
Inventors:
Masateru Tokuno, Nishinomiya, JP;
Tetsuya Sawada, Kyoto, JP;
Assignee:
Rengo Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B31B / ; B26D / ;
U.S. Cl.
CPC ...
493342 ; 493 82 ; 493 83 ; 83103 ; 83107 ; 831551 ; 83151 ;
Abstract
An improved die cutting apparatus separates the gripper margin from the product portion and the releases the gripper margin from the gripper at the same station, i.e. at a pair of rolls. Further, the gripper margin is re-held and re-released at the pair of the rolls to prevent the gripper margins from becoming up with the product portions.