The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 1986
Filed:
Dec. 19, 1984
Jia-Ming Liu, Arlington, MA (US);
Ying C Chen, Closter, NJ (US);
GTE Laboratories Incorporated, Waltham, MA (US);
Abstract
An InGaAsP laser structure having a support structure which contains an equal number of buffer layers and substrate layers is provided. The buffer layers of the support structure drastically reduce the tensile stress in the active layer, thereby eliminating the occurrence of undesired TM emission during normal operation. The semiconductor laser device of the present invention comprises: a support structure having one or more substrate layers and one or more buffer layers, the support structure containing an equal number of substrate layers and buffer layers, the substrate layers consisting of InP, the buffer layers consisting of In.sub.1-x' Ga.sub.x' As.sub.y' P.sub.1-y' with x'.perspectiveto.0.47y' and 0<y'.ltoreq.1, one of the substrate layers providing the lower surface of said semiconductor laser device; a first cladding layer of InP formed on the exposed buffer layer of the support structure; an active layer formed on the first cladding layer, the active layer consisting of In.sub.1-x Ga.sub.x As.sub.y P.sub.1-y with x.perspectiveto.0.47y and y.ltoreq.y'.ltoreq.1 and a second cladding layer of InP formed on the active layer; and a cap layer of In.sub.1-x' Ga.sub.x' As.sub.y' P.sub.1-y' with x'.perspectiveto.0.47y' and 0<y'.ltoreq.1 formed on the second cladding layer; the buffer layers, first cladding layer, active layer, second cladding layer, and cap layer being substantially perfectly lattice-matched with the substrate layers at the growth temperature. Preferably, the buffer layers consist of In.sub.0.53 GA.sub.0.47 As.