Method and apparatus for electronic component matching

Abstract

An electronic component matching system operates in conjunction with a component transport arrangement wherein a component-carrying supply tape from which components are removed for positioning upon a circuit board in a matched manner is linearly displaced. The components are thus sequentially moved to a pick-up point whereupon a predetermined number N of components having similar operating characteristics are incorporated in the same circuit. As the component-carrying supply tape is displaced toward the component pick-up point, an electro-optical sensor detects the presence or absence of components on the supply tape and provides this information to a microcomputer controller. The stationary sensor is positioned in spaced relation from the pick-up point along the component-carrying supply tape displacement path to allow for the detection of the predetermined number of components between the sensor and the pick-up point to ensure that a matched set of N components is available on the tape for incorporation in the same circuit. If the sensor determines that less than N components are present between the sensor and the pick-up point, the microcomputer advances the supply tape to the next group of matched components to prevent components from different matched groups having different operating characteristics from being incorporated in the same circuit. This system is particularly adapted for the automatic positioning of components such as transistors and diodes having matched operating characteristics for incorporation in the same circuit.