The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 1986

Filed:

Feb. 28, 1985
Applicant:
Inventors:

Thomas Shimrock, Chatham, NJ (US);

Victor Rosynsky, Ewing Township, NJ (US);

Theodore M Caridi, Aurora, OH (US);

John M Collins, Sagamore Hills, OH (US);

Michael G Koubek, Maple Heights, OH (US);

Assignee:

Engelhard Corporation, Menlo Park, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; B05D / ; C23C / ;
U.S. Cl.
CPC ...
427-8 ; 118 50 ; 118 501 ; 427238 ; 427243 ; 427294 ; 4274432 ; 502439 ; 502514 ;
Abstract

Method and apparatus for coating catalytic converter substrates with an exact amount of a precious metal. In the course of operation of the apparatus, a hollow substrate to be treated having opposed open ends is transferred from a starting location such that one end is lowered into a dip pan into which has been introduced a predetermined amount of slurry material containing the precious metal. With the one end immersed in the slurry, a vacuum placed on the other end of the substrate draws up the entire charge of slurry from the dip pan to coat the lower portion of the substrate. Thereafter, the substrate is raised from the dip pan. The vacuum continues to operate to cause the coating to be evenly distributed on all the interior surfaces of the substrate. Then the substrate is rotated and again lowered so that the other end is immersed in another predetermined charge of the slurry and the process is repeated. Thereupon, the substrate is again raised from the dip pan. Again, the vacuum continues to operate for a predetermined period of time to assure even distribution of the coating. Then the substrate is again rotated to its original orientation, and returned to its starting location.


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