The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 1986
Filed:
Feb. 07, 1985
Mitsui Petrochemical Industries, Ltd., Tokyo, JP;
Abstract
Disclosed is a molding reinforced polyamide composition comprising [A] a polyamide selected from a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 77 mole % of terephthalic acid component units and 23 to 40 mole % of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) 1,6-diaminohexane units and a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 100 mole % of terephthalic acid component units and 0 to 40 mole % of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) units of a linear aliphatic alkylene-diamine component having 7 to 18 carbon atoms, and [B] a filler in an amount of 0.5 to 200 parts by weight per 100 parts by weight of said polyamide. This composition has excellent heat resistance characteristics, mechanical properties, chemical and physical properties and molding characteristics in combination.