The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 1986

Filed:

Mar. 14, 1984
Applicant:
Inventors:

Heinz Christoph, Erkental, DE;

Jurgen Gamalski, Berlin, DE;

Eduard Lenz, Berlin, DE;

Ulrich Neumann, Berlin, DE;

Reinhard von der Schmidt, Berlin, DE;

Assignee:

Siemens Aktiengesellschaft, Berlin & Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2281801 ; 228219 ; 228232 ; 228238 ; 228240 ; 228 37 ;
Abstract

The invention concerns preventing oxidation of printed circuit board metal surfaces as a result of heat produced in a solder bath arrangement and reducing thermal stress defects from occurring in the circuit carrier being soldered. An enclosed reaction chamber is provided with the solder bath and supplied with a pressurized atmosphere of inert gas which gas seals the reaction chamber from ambient air. The inert gas is discharged from jets against the solder side (the connector post side) of the printed circuit boards at a point upstream of the solder bath and the inert gas is at a temperature substantially higher than the solder bath temperature.


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