The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 1986
Filed:
Mar. 26, 1984
Applicant:
Inventor:
Toshiharu Sakurai, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 67 ; 357 72 ; 75125 ;
Abstract
What is disclosed is a semiconductor apparatus comprises a semiconductor element, a pair of in-line electrode leads having a mounting island supporting the semiconductor element and a molded housing of resin compound. The electrode leads and mounting island are made of an alloy having a thermal expansion coefficient in the range of about 7.times.10.sup.-6 1/C.degree. to about 14.times.10.sup.-6 1/C.degree.. Thus, when the device is subjected to temperature variations, there is little warpage or cracking in the device.