The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 1986
Filed:
Aug. 14, 1984
Applicant:
Inventors:
Shosaku Ishihara, Kamakura, JP;
Takashi Kuroki, Yokohama, JP;
Gyozo Toda, Hino, JP;
Akio Yasukawa, Ibaraki, JP;
Tatsuji Sakamoto, Ibaraki, JP;
Assignee:
Hitachi, Ltd, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 685 ; 361414 ;
Abstract
A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.