The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 1986
Filed:
Dec. 19, 1984
Hisashi Watanabe, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A ceramic-type semiconductor package including a semiconductor pellet, a ceramic lead base having a cavity for accommodating the pellet, and a metal cap for sealing the cavity. The cavity is upward opened, and the metal cap has a central depressed portion to be inserted into the cavity. The central depressed portion has a bottom wall which has a faceted surface. Also, a process for producing a ceramic-type semiconductor package including the steps of providing a semiconductor pellet, providing a ceramic lead base having an upward opened cavity for accommodating the semiconductor pellet, placing the semiconductor pellet in the cavity of the ceramic lead base, pressing a flat metal plate between a male die and a female die, whereby a metal cap having a central depressed portion is produced, inserting the central depressed portion of the metal cap into the cavity of the ceramic lead base, and sealing the peripheral flat portion of the metal cap with a sealing frame bonded on the ceramic lead base. The male die has a faceted surface. The central depressed portion has a bottom wall which has a faceted surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile