The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 1986

Filed:

Jul. 06, 1984
Applicant:
Inventor:

Max S Hendrickson, Forest Lake, MN (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361395 ; 174 / ; 361399 ; 361420 ;
Abstract

An encapsulating apparatus for protecting an electrical circuit, the electrical circuit comprising a plurality of discrete electrical components supported on a circuit board and connected electrically to each other and to external electrical lead lines. The encapsulating apparatus comprises an imperforately walled hollow container defining oppositely first and second openings through the wall thereof. The container further comprises internal support means for receiving and positioning the electrical components in a predetermined relationship to the container and to each other with the lead lines extending outwardly through the first opening. The second opening is completely closed by a cap having a portion corresponding in size and configuration to said second opening. The cap further comprises at least one irregularly shaped arm projecting into the container when the cap is in closing relationship to the second opening, positively fixedly positioning the components in their predetermined relationship. The cap is further retained in closed relationship with respect to the second opening by an epoxy or other suitable means. The container is then substantially filled by a potting compound which is applied as a fluid and hardens rigidly. When the liquid potting compound solidifies, the electrical components are permanently sealed within the container.


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