The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 1986
Filed:
Oct. 01, 1984
Michael J Mirra, Greeneville, TN (US);
Jon W Headrick, Greeneville, TN (US);
Raymond E Giuliani, Greeneville, TN (US);
Ball Corporation, Muncie, IN (US);
Abstract
A zinc alloy, having a copper layer coated thereon, consists essentially of from about 0.1 to about 0.8 weight percent copper, about 0.01 or more weight percent aluminum; up to about 0.05 weight percent magnesium, the balance being essentially zinc. The copper coated zinc alloy is advantageously employed to produce various cast, extruded, molded articles and the like including trim, fixtures as well as coin blanks. Further, the present invention relates to a metal article comprising a zinc base alloy having a copper overlayer in direct contact with the zinc base alloy, said alloy comprising about 1.5 weight percent or less aluminum and the remainder zinc. From another aspect, the subject invention contemplates a method for reducing the diffusion between a copper layer and a zinc base metal, said layer being in direct contact with the zinc base metal, said method comprising incorporating at least about 0.01 weight percent aluminum in said zinc base metal. The invention also contemplates a method for reducing the interdiffusion between a copper electroplate bonded to an underlying zinc metal comprising alloying said zinc metal with about 0.1 to about 0.8 weight percent copper, about 0.01 or more weight percent aluminum, about 0.003 to about 0.05 weight percent magnesium, the balance being essentially zinc, said copper electroplate having a thickness of at least of about 0.00001 inch.