Thermal recording head

Abstract

An improved thermal head for thermal recording includes an array of a plurality of heat generator elements arranged in a direction first, and a plurality of semiconductor chips each thereof including a plurality of transistors for selectively energizing the plural heat generator elements. An array of electrode terminals including the individual electrode terminals of the plurality of transistors each thereof being connected to one electrode of each of the plurality of heat generator elements are formed on one of the major surfaces of each of the semiconductor chips in a second direction substantially perpendicular to the first direction of the heat generator element array. The thermal head further comprises a flexible film associated with each of the semiconductor chips and having a slot or recess surrounding the electrode terminal array. One of the major surfaces of the flexible film is placed on the major surface of the semiconductor chip on which the electrode terminal array is disposed, and a plurality of leads having one end thereof connected respectively to the electrode terminals are disposed on the other major surface of the flexible film substantially in parallel with the heat generator element array. By virtue of the above structure, the thermal head is suitable for thermal recording with a high recording density and can be manufactured at a low cost.