The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 1986
Filed:
Nov. 19, 1984
Saad K Doss, Gilroy, CA (US);
Peter B Phipps, Saratoga, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.