The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 1986
Filed:
Oct. 19, 1983
Heinz Gneiss, Ludwigsburg, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method which serves to bond electrically conductive wires by means of heating and of a soldering material; it is applicable in particular to wire segments of a hot wire fastened on wire holders for measuring the mass of a flowing medium, where the wire segments intersect one another and form a loop. In the method, in a first operation, the wire to be bonded is guided around the respective wire holder such that it forms a loop, and a soldering segment provided with a layer of soldering material comes to rest in the vicinity of the intersection point of the wire segments, in fact only at one of the wire segments. In a second operation, an electrode located at the poles of an electrical current circuit is made to contact the wire segment not provided with soldering material at the intersection point, and in a third operation, the electrical current circuit is closed by the switch for the purpose of resistance heating of the electrode, until the melting temperature of the soldering material is attained and the intersecting wire segments are soldered together at the intersection point.