The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 1986

Filed:

Apr. 09, 1984
Applicant:
Inventor:

Edward D Bunnell, Palm Harbor, FL (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361398 ; 361413 ; 361415 ; 339 / ; 3391 / ; 3391 / ;
Abstract

A high density mother/daughter circuit board connector utilizes a multi-layer flat flexible circuit, each layer of which contains a plurality of patterned arrays of circuit paths extending between spaced contact points, at least some of which are exposed through apertures in overlying layers. The multi-layered circuitry is wrapped around a housing from a mother circuit board face to extend into one side of a daughter board receiving recess. Camming means arranged in the opposite side of the recess drive a daughter circuit board inserted therein transversely of the recess into loaded engagement with the multi-layer circuitry thereby establishing electrical interconnection between the circuitry of the mother and daughter circuit boards.


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