The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1986
Filed:
Dec. 06, 1983
Applicant:
Inventors:
Assignee:
The Welding Institute, Cambridge, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2191 / ; 2191 / ;
Abstract
In the bumped-tape automated bonding process for connecting leads to a semi-conductor circuit device, it is known to form the bumps on the free ends of the conductive leads of the tape by plating or etching. In the present invention, the free ends of the leads on the tape are heated by means of a laser beam to melt the ends of the leads so that surface tension forces form the liquid-phase end of each lead into a ball, constituting the bonding bump. The bumped ends of the leads of the tape are then bonded to terminals of the semiconductor device by conventional means.