The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 1986
Filed:
Feb. 13, 1984
Shepard Drazin, Los Angeles, CA (US);
William P Van Antwerp, Pacific Palisades, CA (US);
GSP Metals & Chemicals Corporation, Los Angeles, CA (US);
Abstract
A method for plating metallic leads or terminals of integrated circuits having a leaded glass component with a plating composition that avoids dentrite growth, can be soldered, and is corrosion resistant is disclosed. According to the method, the metallic element is electroplated with lead and tin simultaneously. An aqueous plating solution comprising water, sulphate ion, tin, and chelated lead, where the lead is chelated with either ethylene diamine or ethylene diamine gluconate, is formed. The metallic element with a leaded glass portion is placed in the solution and an electrical current is passed through this solution to deposit lead and tin on the metallic element to form a plating comprising at least about 90 percent by weight tin, and at least about 2 percent by weight lead. The plating solution and the plated substrate produced by the method of the present invention are also novel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile