The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 1986
Filed:
Feb. 14, 1985
Applicant:
Inventors:
Assignee:
Hitachi Condenser Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B05D / ; B44C / ; C23F / ;
U.S. Cl.
CPC ...
156278 ; 29852 ; 156645 ; 156656 ; 156666 ; 156668 ; 156902 ; 427 97 ; 427302 ; 427307 ;
Abstract
A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.
Uozu, Nobuo. (1986). Process for producing printed circuit board (U.S. Patent No. 4585502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4585502
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile