The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1986
Filed:
Oct. 20, 1983
Applicant:
Inventors:
Daniel J Shanefield, Princeton Township, Mercer County, NJ (US);
Fred W Verdi, Lawrence Township, Mercer County, NJ (US);
Assignee:
AT&T Technologies, Inc., Berkeley Heights, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ; C25D / ;
U.S. Cl.
CPC ...
156643 ; 156668 ; 156902 ; 204 30 ; 204 321 ; 2041 / ; 2041 / ; 427 40 ; 427 98 ; 427 99 ; 427306 ; 427307 ;
Abstract
A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.