The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1986
Filed:
Nov. 28, 1984
Applicant:
Inventors:
Yoshikazu Hazuki, Tokyo, JP;
Takahiko Moriya, Yokosuka, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
156643 ; 29591 ; 156644 ; 156646 ; 156657 ; 1566591 ; 2041 / ; 2041 / ; 357 71 ; 427 90 ; 427 91 ; 427 93 ;
Abstract
First conductive members are buried in first holes formed in a first insulating film to connect the second interconnection layers, formed through first and second insulating films, to a semiconductor substrate. Second conductive members are buried in second holes formed to be positioned on the first holes of the second insulating film. Thus, the reliability of a semiconductor device of a multi-layer interconnection structure is improved, and the integration thereof is improved.