The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 1986
Filed:
Feb. 28, 1985
Teiji Majima, Hatano, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A process for manufacturing a dual spacing type magnetic bubble memory chip having a thin garnet film, on which a first area is provided with minor loop transmission lines for memorizing bubble information and a second area is provided with major transmission lines for recording or reading out the bubble information. The process comprises forming a first insulative layer (SiO.sub.2) on the garnet film over the first and second areas, forming conductive patterns on the SiO.sub.2 layer, coating the SiO.sub.2 layer and conductive patterns with a second insulative layer of resin (PLOS) and thermosetting the coated insulative layer, removing by etching part of the SiO.sub.2 and PLOS layers, which exist on the first area, forming a third insulative layer (SiO.sub.2) over the whole surface including the first and second areas, and forming the minor loop transmission lines and the major transmission lines on the third insulative layer.