The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 1986

Filed:

Nov. 29, 1984
Applicant:
Inventor:

Roger L Krechmery, Riverside, CA (US);

Assignee:

Bourns Instruments, Inc., Riverside, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L / ;
U.S. Cl.
CPC ...
73721 ; 73727 ; 338-4 ; 338 42 ;
Abstract

A pressure transducing device in the form of a beam includes a monolithic chip of silicon or similar material which is mechanically supported at and near its two opposed ends and unsupported in a flexible region between the two ends. The flexible, unsupported region is one of maximized sensitivity to stresses produced by deflection or flexing of the beam due to, e.g., a differential pressure applied across it. An integral, pressure-responsive diaphragm is formed in the supported area of the chip near one of its mechanically-supported ends. This area of the chip is relatively insensitive to stresses produced by beam flexing or deflection; rather, it responds to stresses produced by a pressure (e.g., a static pressure) applied directly to its surface. A first set of strain gauges is provided in the flexible chip region, and a second set on the surface of the integral diaphragm. Thus, a single transducing element is formed which provides separate output signals simultaneously indicative of both differential and static pressures experienced by, respectively, the unsupported chip region and the surface of the integral diaphragm.


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